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With thousands of PC and file server builds and hundreds of implementations to our credit, The G Squared organization has the necessary experience to provide the equipment and engineering services unequaled anywhere in the industry. The companies and organizations affiliated with G Squared include every major player in the technology world. Intel, Microsoft, Dell, Lenovo, Netgear, HP to name just a few. These associations keep G Squared on the leading edge of development and technology which keeps our customers ahead of the technology curve.
I am reminded of the wisdom of the old saw that “no news is good news” as almost every day [...]
New Technologies to Improve Time to Market and Reduce Costs
SANTA CLARA, Calif., Aug. 27, 2014 – Intel Corporation today announced two new technologies for Intel Custom Foundry customers that need cost-effective advanced packaging and test technologies.
Embedded Multi-die Interconnect Bridge (EMIB), available to 14nm foundry customers, is a breakthrough that enables a lower cost and simpler 2.5D packaging approach for very high density interconnects between heterogeneous dies on a single package. Instead of an expensive silicon interposer with TSV (through silicon via), a small silicon bridge chip is embedded in the package, enabling very high density die-to-die connections only where needed. Standard flip-chip assembly is used for robust power delivery and to connect high-speed signals directly from chip to the package substrate. EMIB eliminates the need for TSVs and specialized interposer silicon that add complexity and cost.
"The EMIB technology enables new on-package functionality that may have been too costly to pursue with previous solutions," said Babak Sabi, Intel vice president and director, Assembly and Test Technology Development.
Intel also announced the availability of its revolutionary High Density Modular Test (HDMT) platform. HDMT, a combination of hardware and software modules, is Intel's test technology platform that targets a range of products in diverse markets including server, client, system on chip, and Internet of Things. Until now, this capability was only available internally for Intel products. Today's announcement makes HDMT available to customers of Intel Custom Foundry.
"We developed the HDMT platform to enable rapid test development and unit-level process control. This proven capability significantly reduces costs compared to traditional test platforms. HDMT reduces time to market and improves productivity as it uses a common platform from low-volume product debug up to high-volume production," said Sabi.
EMIB is available to foundry customers for product sampling in 2015 and HDMT is available immediately.
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.
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Flipkart, one of India’s largest e-commerce marketplaces, announced five new tablets under its brand Digiflip Pro powered by Intel® Atom™ Processors. The tablets include two 8”, two 9” and a 7” tablet and will be exclusively available on www.flipkart.com. These new Intel-based tablets offer amazing features, graphics, great performance with long battery life, all packed into sleek form factors.
At the 2014 Intel Developer Forum (IDF) in San Francisco, held September 9-11, Intel will re-instate its annual Technology Innovation Accelerated (TIA) Awards. The Intel TIA Awards recognizes the best innovations based on the latest Intel technologies across 10 categories. In addition to category winners, three best of show winners will be selected for each award group – Hardware, Software & Services and Combined Solutions. Award finalists will be determined by a panel of judges and announced on September 9. Winners will be determined by participating press and analysts and announced on the evening of September 10 at the IDF Technology Showcase.
An enterprise can pay hundreds of thousands of dollars or more for the latest security software and imagine itself protected [...]