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G Squared Computing was founded over a decade ago with the objective of providing the highest level, state of the art computing hardware and engineering services in the industry. Our forty plus years of combined experience with regard to hardware, software and engineering services has allowed G Squared to gain an intimate understanding of the industry.

With thousands of PC and file server builds and hundreds of implementations to our credit, The G Squared organization has the necessary experience to provide the equipment and engineering services unequaled anywhere in the industry. The companies and organizations affiliated with G Squared include every major player in the technology world. Intel, Microsoft, Dell, Lenovo, Netgear, HP to name just a few. These associations keep G Squared on the leading edge of development and technology which keeps our customers ahead of the technology curve.

  • Fortinet to Announce Second Quarter 2013 Financial Results

    Published: July 2013

  • Nine HIPAA Network Considerations

    Published: July 2013

  • You’re Only as Secure as Your Weakest Link: Operationalizing Security

    Published: August 2014

    I am reminded of the wisdom of the old saw that “no news is good news” as almost every day [...]

  • Intel Announces New Packaging and Test Technologies for Foundry Customers

    Published: August 2014

    New Technologies to Improve Time to Market and Reduce Costs


    SANTA CLARA, Calif., Aug. 27, 2014 – Intel Corporation today announced two new technologies for Intel Custom Foundry customers that need cost-effective advanced packaging and test technologies.


    Embedded Multi-die Interconnect Bridge (EMIB), available to 14nm foundry customers, is a breakthrough that enables a lower cost and simpler 2.5D packaging approach for very high density interconnects between heterogeneous dies on a single package. Instead of an expensive silicon interposer with TSV (through silicon via), a small silicon bridge chip is embedded in the package, enabling very high density die-to-die connections only where needed. Standard flip-chip assembly is used for robust power delivery and to connect high-speed signals directly from chip to the package substrate. EMIB eliminates the need for TSVs and specialized interposer silicon that add complexity and cost.


    "The EMIB technology enables new on-package functionality that may have been too costly to pursue with previous solutions," said Babak Sabi, Intel vice president and director, Assembly and Test Technology Development.


    Intel also announced the availability of its revolutionary High Density Modular Test (HDMT) platform. HDMT, a combination of hardware and software modules, is Intel's test technology platform that targets a range of products in diverse markets including server, client, system on chip, and Internet of Things. Until now, this capability was only available internally for Intel products. Today's announcement makes HDMT available to customers of Intel Custom Foundry.


    "We developed the HDMT platform to enable rapid test development and unit-level process control. This proven capability significantly reduces costs compared to traditional test platforms. HDMT reduces time to market and improves productivity as it uses a common platform from low-volume product debug up to high-volume production," said Sabi.


    EMIB is available to foundry customers for product sampling in 2015 and HDMT is available immediately.


    About Intel
    Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel's conflict-free efforts at conflictfree.intel.com.


    Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.


    *Other names and brands may be claimed as the property of others.

  • Chip Shot: India's Flipkart Launches Five New Tablets Powered by Intel

    Published: August 2014

    flipkart_tablet.jpgFlipkart, one of India’s largest e-commerce marketplaces, announced five new tablets under its brand Digiflip Pro powered by Intel® Atom™ Processors. The tablets include two 8”, two 9” and a 7” tablet and will be exclusively available on www.flipkart.com. These new Intel-based tablets offer amazing features, graphics, great performance with long battery life, all packed into sleek form factors.

  • Chip Shot: Intel Brings Technology Innovation Accelerated Awards Back to IDF

    Published: August 2014

    At the 2014 Intel Developer Forum (IDF) in San Francisco, held September 9-11, Intel will re-instate its annual Technology Innovation Accelerated (TIA) Awards. The Intel TIA Awards recognizes the best innovations based on the latest Intel technologies across 10 categories. In addition to category winners, three best of show winners will be selected for each award group – Hardware, Software & Services and Combined Solutions. Award finalists will be determined by a panel of judges and announced on September 9. Winners will be determined by participating press and analysts and announced on the evening of September 10 at the IDF Technology Showcase.

  • Social Engineering:
 Finding the Weak Links In-Person

    Published: August 2014

    An enterprise can pay hundreds of thousands of dollars or more for the latest security software and imagine itself protected [...]

Need Answers Fast?

Call 858-715-3837 or email us for immediate assistance. We can often provide relief via a simple, safe and secure remote session. If that isn't possible we can generally have a technician onsite the same day as your call is received.

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