Intel

Need Answers Fast?

Call 858-715-3837 or email us for immediate assistance.

Get Support Now

July 30 2015

Chip Shot: Intel Security Positioned as a Leader in the Gartner Magic Quadrant for SIEM

Intel Security today announced that leading research firm Gartner, Inc. has positioned the company in the leaders quadrant for its “Magic Quadrant for Security Information and Event Management” (SIEM) as published on July 20, 20151. According to the report, “Organizations are failing at early breach detection, with more than 92% of breaches undetected by the breached organization. The situation can be improved with stronger threat intelligence, the addition of behavior profiling and better analytics.” Additionally, the report highlights that “during 2014, the SIEM market grew from $1.5 billion to approximately $1.69 billion, achieving a growth rate of about 14%. The primary drivers that were in place at the start of 2014 remain in effect. Threat management is the primary driver, and compliance remains a secondary driver.” View a copy of the Gartner 2015 Magic Quadrant for SIEM report and learn more about McAfee SIEM solutions.

1 Gartner, Inc., Magic Quadrant for Security Information and Event Management, K. Kavanaugh, O. Rochford, July 20, 2015

July 29 2015

Chip Shot: Graphics on IntelĀ®-powered Devices Get Optimized for Windows 10

In order to further optimize Intel® processors for Windows* 10, Intel today released new graphics drivers for 4th and 5th generation Intel® Core™ processors with Intel® HD Graphics, Intel® Iris™ Graphics and Iris™ Pro Graphics, N series Intel® Pentium® and Intel® Celeron® processors with Intel® HD graphics (formerly codenamed Braswell). The drivers also support several new features, including Microsoft DirectX* 12, Microsoft PlayReady* and Miracast*. Users can download the drivers from Intel’s website or check with their device’s manufacturer to get the latest drivers for their specific machine.

July 28 2015

Chip Shot: Windows 10 and Intel Bring New Computing Experiences to Life

With the launch of Microsoft Windows* 10 today, the computing industry and people everywhere have a lot to celebrate. Intel collaborated with Microsoft to ensure people who have Intel-powered devices have a great Windows 10 experience. To learn more a…

July 28 2015

Chip Shot: Intel and Micron Reveal Breakthrough Memory Technology

Intel and Micron today unveiled 3D XPoint™ technology, the first new memory category in more than 25 years. 3D XPoint technology makes new innovations possible in applications that benefit from fast access to large sets of data, such as machine learning, real-time tracking of diseases and immersive 8K gaming. The technology uses unique material compounds and an innovation cross point architecture to deliver speeds up to 1000 times faster than NAND, and it is 10 times denser than conventional memory. Learn more about the announcement and watch the webcast.

Interactive Photo Capsule: 3D XPoint™ Technology

July 28 2015

Intel and Micron Produce Breakthrough Memory Technology

New Class of Memory Unleashes the Performance of PCs, Data Centers and More

NEWS HIGHLIGHTS

  • Intel and Micron begin production on new class of non-volatile memory, creating the first new memory category in more than 25 years.
  • New 3D XPoint™ technology brings non-volatile memory speeds up to 1,000 times faster1 than NAND, the most popular non-volatile memory in the marketplace today.
  • The companies invented unique material compounds and a cross point architecture for a memory technology that is 10 times denser than conventional memory2.
  • New technology makes new innovations possible in applications ranging from machine learning to real-time tracking of diseases and immersive 8K gaming.

3D_XPoint_Die_1000.jpg

3D Xpoint™ technology is up to 1000x faster than NAND and an individual die can store 128Gb of data

3D XPoint Wafer Close-Up_1000.jpg

3D Xpoint™ technology wafers are currently running in production lines at Intel Micron Flash Technologies fab

SANTA CLARA, Calif., and BOISE, Idaho, July 28, 2015 – Intel Corporation and Micron Technology, Inc. today unveiled 3D XPoint™ technology, a non-volatile memory that has the potential to revolutionize any device, application or service that benefits from fast access to large sets of data. Now in production, 3D XPoint technology is a major breakthrough in memory process technology and the first new memory category since the introduction of NAND flash in 1989.

The explosion of connected devices and digital services is generating massive amounts of new data. To make this data useful, it must be stored and analyzed very quickly, creating challenges for service providers and system builders who must balance cost, power and performance trade-offs when they design memory and storage solutions. 3D XPoint technology combines the performance, density, power, non-volatility and cost advantages of all available memory technologies on the market today. The technology is up to 1,000 times faster and has up to 1,000 times greater endurance3 than NAND, and is 10 times denser than conventional memory.

“For decades, the industry has searched for ways to reduce the lag time between the processor and data to allow much faster analysis,” said Rob Crooke, senior vice president and general manager of Intel’s Non-Volatile Memory Solutions Group. “This new class of non-volatile memory achieves this goal and brings game-changing performance to memory and storage solutions.”

“One of the most significant hurdles in modern computing is the time it takes the processor to reach data on long-term storage,” said Mark Adams, president of Micron. “This new class of non-volatile memory is a revolutionary technology that allows for quick access to enormous data sets and enables entirely new applications.”

As the digital world quickly grows – from 4.4 zettabytes of digital data created in 2013 to an expected 44 zettabytes by 20204 – 3D XPoint technology can turn this immense amount of data into valuable information in nanoseconds. For example, retailers may use 3D XPoint technology to more quickly identify fraud detection patterns in financial transactions; healthcare researchers could process and analyze larger data sets in real time, accelerating complex tasks such as genetic analysis and disease tracking.

The performance benefits of 3D XPoint technology could also enhance the PC experience, allowing consumers to enjoy faster interactive social media and collaboration as well as more immersive gaming experiences. The non-volatile nature of the technology also makes it a great choice for a variety of low-latency storage applications since data is not erased when the device is powered off.

New Recipe, Architecture for Breakthrough Memory Technology

Following more than a decade of research and development, 3D XPoint technology was built from the ground up to address the need for non-volatile, high-performance, high-endurance and high-capacity storage and memory at an affordable cost. It ushers in a new class of non-volatile memory that significantly reduces latencies, allowing much more data to be stored close to the processor and accessed at speeds previously impossible for non-volatile storage.

The innovative, transistor-less cross point architecture creates a three-dimensional checkerboard where memory cells sit at the intersection of word lines and bit lines, allowing the cells to be addressed individually. As a result, data can be written and read in small sizes, leading to faster and more efficient read/write processes.

Interactive Photo Capsule: 3D XPoint™ Technology

3D XPoint technology will sample later this year with select customers, and Intel and Micron are developing individual products based on the technology.

Multimedia Elements

For additional information, visit:

Media Kit – Micron / Intel

Contribute to the memory technology conversations through Intel’s social channels:

Take part in Micron’s social conversations where we’re talking all things storage and memory:

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, 3D XPoint and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Micron Technology, Inc.
Micron Technology, Inc., is a global leader in advanced semiconductor systems. Micron’s broad portfolio of high-performance memory technologies—including DRAM, NAND and NOR Flash—is the basis for solid state drives, modules, multichip packages and other system solutions. Backed by more than 35 years of technology leadership, Micron’s memory solutions enable the world’s most innovative computing, consumer, enterprise storage, networking, mobile, embedded and automotive applications. Micron’s common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com

©2015 Micron Technology, Inc. All rights reserved. Micron and the Micron orbit logo are trademarks of Micron Technology, Inc.

This document contains forward looking statements. Forward looking statements are predictions, projections and other statements about future events that are based on current expectations and assumptions and, as a result, are subject to risks and uncertainties. Many factors could cause actual results to differ materially from the forward-looking statements in this document. A detailed discussion of the factors that could affect Intel’s results and plans is included in Intel’s SEC filings, including the annual report on Form 10-K.

1 Performance difference based on comparison between 3D XPoint technology and other industry NAND

2 Density difference based on comparison between 3D XPoint technology and other industry DRAM 

3 Endurance difference based on comparison between 3D XPoint technology and other industry NAND 

4 www.emc.com/leadership/digital-universe/2014iview/executive-summary.htm

July 23 2015

Intel and Micron Produce Breakthrough Memory Technology

Intel and Micron unveil 3D Xpoint™ technology and create the first new memory category in more than 25 years.

3D XPoint™ Technology Revolutionizes Storage Memory

Additional Videos

back to topImagery

Interactive Photo Capsule: 3D XPoint™ Technology

back to topInfographics

Infographic: What is 3D Xpoint™ Technology

newsroom-infogfx-teaser-xpoint-v1.jpg

Infographic: Breakthroughs in Memory Technology

newsroom-infogfx-teaser-breaktrough-v2.jpg

back to topSocial Media

Intel’s Social Channels

Micron’s Social Conversations

back to topRelated Information

Related Information on Intel.com

July 23 2015

Intel Announces ‘Cloud for All’ Initiative to Deliver Benefits of the Cloud to More Businesses

Includes Industry Investments and Collaborations to Unleash Tens of Thousands of New Clouds; Intel Announces Collaboration with Rackspace to Deliver Easy-to-Deploy Clouds

SANTA CLARA, Calif., July 23, 2015 – Intel Corporation today announced the Intel® Cloud for All initiative to accelerate cloud adoption by making public, private and hybrid cloud solutions easier to deploy. Through a series of investments and collaborations in the cloud software ecosystem, Intel believes the initiative will help businesses take advantage of the cloud benefits to deliver new capabilities and digital services, leading to tens of thousands of new cloud deployments.

While the Intel Cloud for All initiative is designed to benefit clouds of various sizes and types, enterprise cloud adoption has been particularly stifled by complexity, lack of scalability and gaps in open source enterprise-grade features. Removing these obstacles will enable companies to deploy more highly optimized and scalable cloud infrastructure that delivers new services more efficiently.

“The cloud has been critical to the digital services economy and has enabled tremendous innovation and business growth, but broad enterprise adoption is not happening fast enough,” said Diane Bryant, senior vice president and general manager of Intel’s Data Center Group. “We believe that through this initiative we will enable our customers to realize the benefits and innovations gained from the latest cloud computing technologies.”

Unlocking the Next Wave of Cloud Deployments

Consumer services from major cloud service providers have driven the first wave of cloud adoption, accounting for 75 percent of current cloud usage. However, over the next five years, opportunities created from the Internet of Things and big data analytics solutions will be leading drivers for enterprise cloud growth. According to industry research firm IDC, organizations will spend an additional $142.8 billion on infrastructure for both public and private cloud environments in the next three years (2016-2018) to boost efficiency and business agility1.

The Intel Cloud for All initiative will focus on three primary areas to accelerate new cloud deployments and help businesses get the most from their cloud infrastructure:

  • Investing in the ecosystem to accelerate enterprise-ready, easy-to-deploy software defined infrastructure (SDI) solutions;
  • Optimizing SDI solutions to deliver highly efficient clouds across a range of workloads by taking full advantage of Intel platform capabilities; and
  • Aligning the industry and engaging the community through open industry standards, solutions and routes to market to accelerate cloud deployment.

New Collaboration with Rackspace*

As a key part of this initiative, Intel is announcing today a new collaboration with Rackspace*, the co-founder and leading operator of OpenStack*, the predominant open source cloud software platform. Intel and Rackspace will establish the OpenStack Innovation Center to focus on driving enterprise features and scale optimizations into the OpenStack source code.

The OpenStack Innovation Center will include the world’s largest OpenStack developer cloud consisting of two 1,000-node clusters that will be available to the OpenStack community-at-large to support advanced, large-scale testing of OpenStack performance, code and new features. These testing clusters are expected to be available within the next six months.

The companies will also focus on the delivery of new enterprise features and optimizations that are aligned with the OpenStack Enterprise Working Group and community priorities. New modules of courseware will also be offered to onboard and increase the number of open source developers actively contributing to the success of the community.

Teleconference and Presentation

Intel will hold a teleconference today at 10:00 a.m. PT (1:00 p.m. ET) to discuss the Cloud for All initiative and the Rackspace collaboration. The live teleconference can be accessed in the United States at 1-888-339-2688 and outside the United States at +1-617-847-3007 with the passcode 83629340. To view the slide presentation, click here. A replay of the teleconference will be available shortly at http://newsroom.intel.com/community/intel_newsroom/blog/2015/07/23/intel-announces-cloud-for-all-initiative-to-deliver-benefits-of-the-cloud-to-more-businesses.

Supporting Resources *available at 10:00 a.m. Pacific*

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com, and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with your system manufacturer or retailer or learn more at www.intel.com.

1 IDC Worldwide Quarterly Cloud IT Infrastructure Tracker, market forecast, July 2015.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

July 23 2015

Intel Declares Quarterly Cash Dividend

SANTA CLARA, Calif., July 23, 2015 – Intel Corporation’s board of directors has declared a quarterly dividend of 24 cents per share (96 cents per share on an annual basis) on the company’s common stock. The dividend will be payable on September 1, 2015, to stockholders of record on August 7, 2015.

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com, and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

July 22 2015

Chip Shot: ASUS and AT&T Introduce Intel-powered $119 Pre-paid ASUS ZenFone™ 2E for US Market

ASUS ZenFone 2E

The ASUS ZenFone 2E powered by an Intel Atom processor and Intel LTE modem, is a budget-friendly option starting at US $119.

AT&T and ASUS announced the commercial availability of the ASUS ZenFone 2E, powered by a dual-core Intel® Atom™ processor and Intel® XMM™ 7160 LTE modem.  The Intel Atom processor enables efficient multitasking and performance in a sleek, five-inch HD phone.  The phone will be available for US$119 on an AT&T pre-paid GoPhone® plan at AT&T stores nationwide on July 24th, and other national retailers including Walmart*, Target* and Best Buy*.

July 22 2015

Intel Developer Forum 2015: ‘Developed by You’

WHEN:

Aug. 18-20, 2015

WHERE:

Moscone Center West, San Francisco

WHAT:
Intel CEO Brian Krzanich

Intel CEO Brian Krzanich

The 2015 Intel Developer Forum (IDF) will bring together the developers, technologists and makers who create the products, engineer the systems, render the movies and power the toys that deliver amazing experiences. At the annual conference, Intel will share its vision and latest innovations to spark new ideas, collaboration and conversation with its partners.

Intel CEO Brian Krzanich will kick off the event at 9 a.m. on Aug. 18 with a keynote focused on the evolution of technology and the increasing personalization of computing that is creating unprecedented opportunities for developers to drive new innovation with Intel technology. With the theme “Developed by You,” IDF 2015 will include “Mega Sessions” focused on the hottest topics in the technology industry including:

More than 160 technical sessions with industry and Intel experts will also be offered over the three-day event as well as a vast showcase featuring demonstrations of innovations by 180 leading technology companies.

IDF 2015 will also provide media and analysts opportunities to speak one-to-one with industry experts and Intel engineers whose work will impact the direction of future technologies. They will have full access to all of the general and technical sessions, including Technical Insights, lecture sessions and hands-on labs.

ATTENDANCE:

More than 5,000 attendees are expected from around the world.

INFORMATION:

www.intel.com/newsroom/idf

CONTACTS:

William Giles

+1-919-678-2858

william.e.giles@intel.com