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November 19 2014

Chip Shot: World’s First Crowdsourced Tablet Launched Today from Jolla, Powered by Intel

Press-single_tablet_hand_multitasking.jpgThe Finnish mobile company Jolla today introduced its first tablet based on Intel technology. Jolla tablet will be the world’s first crowdsourced tablet project on the Indiegogo crowdfunding platform, offering its customers the opportunity to participate in the development of the tablet.  The new tablet is based on the Intel® Atom™ processor 3700 Series, running on the company’s independent operating system Sailfish, providing multitasking experience with Android application compatibility. Users can now contribute to this Jolla Tablet project through the Indiegogo campaign starting at $189 for the first contributors in all European Union countries, Norway, Switzerland, United States, India, China, Hong Kong and Russia. Jolla Tablet shipments are expected to start in the second quarter of 2015.

November 19 2014

Chip Shot: Intel Earns Perfect Score in 2015 Human Rights Campaign Foundation’s Corporate Equality Index

Intel earned a perfect score of 100 percent on the Human Rights Campaign (HRC) Foundation’s Corporate Equality Index (CEI), a national benchmarking survey and report on corporate practices related to LGBT workplace equality. Intel was also honored by HRC as a Best Place to Work for LGBT Equality. The report evaluated non-discrimination workplace protections, benefits and public engagement with the LGBT community.

November 18 2014

Chip Shot: Nokia Announces Intel-powered N1 Android Tablet

Nokia today announced the first Nokia-branded Android tablet based on Intel technology. The N1 offers an innovative interface called the Nokia Z Launcher and an industrial design by Nokia that focuses on simplicity. Powered by the 64-bit Intel® At…

November 18 2014

Chip Shot: Intel Science Talent Search Triples Top Awards for 2015

Intel Science Talent Search, a program of Society for Science & the Public, will now offer three top awards of $150,000 in 2015. The Intel Foundation has increased funding to the nation’s oldest and most prestigious high school science and math competition to more than $1.6 million and will award “Medals of Distinction” to students who show exceptional scientific potential in three areas: Basic Research, Global Good, and Innovation. Learn more about Intel Science Talent Search.

November 18 2014

MICA, My Intelligent Communication Accessory

Opening Ceremony, Intel take wraps off capabilities for MICA at NYC launch eventVideosNews ArticlesImageryRelated Information
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November 18 2014

Intel Custom Foundry Demonstrates Industry-Leading 32 Gbps SerDes on 14nm Process

Operating Range Broadened to 1 to 32 Gbps While Extending Power, Performance, Area Leadership

NEWS HIGHLIGHTS

  • Builds on the power, performance and area leadership of the 1 to 16 Gbps GP SerDes already demonstrated on 14nm
  • Extends operating range to 1 to 32 Gbps while fully supporting the 28 Gbps common electrical I/O (CEI) long-reach specification
  • Offers extreme flexibility and programmability to cover the industry’s broadest range of SerDes protocols

SANTA CLARA, Calif., Nov. 18, 2014 – Intel Corporation today unveiled silicon characterization results for its 1 to 32 Gbps high-speed SerDes on the 14nm process. This 32 Gbps SerDes is the second SerDes offering and adds to the previously announced 1 to 16 Gbps GP 14nm SerDes. It will be available by end of this year.

Intel’s 14nm SerDes family is the second generation of SerDes offering and is built on the success of Intel’s 12 and 28 Gbps SerDes, which is currently in production on Intel’s 22nm Tri-gate process technology. Intel’s 14nm SerDes extends the operating range while reducing power by 20 percent and area by more than 40 percent as compared to Intel’s 22nm SerDes offering.

This announcement marks the first time that a 32 Gbps, multiprotocol SerDes has been validated on any sub-20nm foundry process.

“Our SerDes architecture continues to improve with each successive development in the Tri-gate process” said Ali Farhang, vice president, Design and Enablement Services, Intel Custom Foundry. “We are able to meet the 28G CEI LR spec while supporting operation down to 1 Gbps, thus enabling flexibility in our customers’ products.”

The 1 to 32 Gbps SerDes spans a wide range of protocols, such as USB, PCIe, Ethernet and 10G-KR with extremely low jitter while maintaining power and area efficiency. This efficiency extends to emerging protocols like OIF, 100G Ethernet and 32 Fibre Channel. Intel’s SerDes is a complete offering providing orientation flexibility and protocol configurability with extensive documentation for integration, test and verification, enabling ease of integration.

“We evaluated many SerDes suppliers for our high-performance Achronix FPGAs,” said Robert Blake, CEO of Achronix. “Both the 12.75G SerDes using Intel’s 22nm technology and the 32G SerDes using Intel’s 14nm technology met our stringent power/performance requirements and the broad range of features that we needed. The SerDes from Intel Custom Foundry is a key differentiating technology for the growing range of high-speed interfaces that our FPGAs require.”

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com, www.intel.com/foundry and blogs.intel.com, and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

November 17 2014

Intel Announces Date of Annual Investor Meeting

SANTA CLARA, Calif., Nov. 17, 2014 – Intel Corporation will hold its annual investor meeting on Thursday, Nov. 20, starting at 8 a.m. PST. The live webcast and the presentation materials will be available at www.intc.com.

Intel’s management team will provide updates on the company’s strategy, business and products.

Time Speaker Subject
8-8:10 a.m. Mark Henninger, vice president of Finance and director of Investor Relations Agenda and risk factors
8:10-8:20 a.m. Andy Bryant, Intel chairman of the board Opening remarks
8:20-9:10 a.m. Brian Krzanich, Intel CEO Corporate strategy
9:10-9:40 a.m. Bill Holt, Intel executive vice president and general manager of the Technology and Manufacturing Group Advancing Moore’s Law
9:40-10:30 a.m. Stacy Smith, Intel executive vice president and CFO Financials
10:30-10:50 a.m. Holt, Krzanich and Smith Q&A session
10:50-11:05 a.m. Break
11:05-11:45 a.m. Diane Bryant, Intel senior vice president and general manager of the Data Center Group Data Center Group business update
11:45 a.m.-12:25 p.m. Kirk Skaugen, Intel senior vice president and general manager of the PC Client Group PC Client Group business update
12:25-12:45 p.m. Bryant and Skaugen Q&A session
12:45-1:45 p.m. Lunch break
1:45-3:45 p.m.

Renée James, Intel president

Guest speakers, in order of appearance, will include: Hermann Eul, Intel vice president and general manager of the Mobile and Communications Group; Doug Davis, Intel vice president and general manager of the Internet of Things Group; and Rob Crooke, Intel vice president and general manager of the Non-Volatile Memory Solutions Group

Intel platform technology investments


Speakers and agenda times are subject to change.

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com, and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

November 17 2014

Opening Ceremony, Intel Take Wraps off Capabilities for MICA, My Intelligent Communication Accessory

MICA displaying SMS

MICA displaying SMS

MICA displaying Near Me feature powered by Yelp

MICA displaying Near Me feature powered by Yelp

NEWS HIGHLIGHTS

  • MICA, My Intelligent Communication Accessory, designed by Opening Ceremony, engineered by Intel, connects fashion-forward women to text messages, Google** and Facebook* notifications, and local business recommendations powered by Yelp* and TomTom*.
  • An intelligent bracelet composed of precious gems and Ayers snakeskin, MICA will retail for $495, which includes two years of AT&T* wireless data service provided by Intel.
  • MICA will be available by early December exclusively in the U.S. at Opening Ceremony New York and Los Angeles, select Barneys New York locations, and online at OpeningCeremony.us and Barneys.com.

NEW YORK, Nov. 17, 2014 – Opening Ceremony and Intel today took the wraps off the complete features of MICA, My Intelligent Communication Accessory, the smart and fashionable luxury accessory that truly redefines the concept of wearable technology. MICA is a beautiful and intelligent bracelet that provides today’s highly connected woman with access to text messages, Yelp, Gmail** notifications, Facebook events and Google Calendar** through discreet notifications delivered directly to the wrist.

The feminine communications accessory will be available by early December in the United States and will retail exclusively at Opening Ceremony New York and Los Angeles, select Barneys New York locations, and online at Openingceremony.us and Barneys.com.

“Our pioneering collaboration with Opening Ceremony and the introduction of this category-defining smart jewelry piece advances wearable technology as a distinctively stylish accessory that places importance on both aesthetics and functionality,” said Ayse Ildeniz, vice president and general manager for business development and strategy, New Devices Group at Intel Corporation. “MICA captures Intel’s philosophy that technology should enhance jewelry in order to make wearable technology truly ‘wantable,’ in addition to seamless and productive.”

“Today’s modern woman maintains selectivity and exclusivity when choosing accessories, and MICA embodies a beautifully unique statement piece,” said Humberto Leon, co-founder and creative director, Opening Ceremony. “The wearable space is an exciting, rapidly expanding category, and it has been a thrill to be involved in the convergence of fashion and technology through this collaboration with Intel.”

“Mobile technology really guides everything we do. The issue for many consumers on wearable technology lies in the fact that the devices typically are not attractive and are often times cumbersome,” said Daniella Vitale, chief operating officer and senior executive vice president, Barneys New York. “Opening Ceremony founders Carol and Humberto, along with Intel, had the prescience to create something functional but also beautiful and chic. We are excited to be the first on something that mirrors the Barneys strategy of a beautiful, exclusive and unique product!”

“MICA acts as an extension of a customer’s smartphone, for those times when it’s not convenient to carry with you,” said Chris Penrose, senior vice president, Internet of Things, AT&T. “It allows customers to receive texts and email notifications so that they can stay connected, while still wearing a fashionable jewelry piece to almost any occasion.”

MICA PRODUCT HIGHLIGHTS:

Reflecting market research garnered from the Opening Ceremony community and influencers in the industry, Opening Ceremony and Intel developed the design, features and purpose of the MICA bracelet for the woman who is always on the go and enjoys being socially connected, and who has a deep appreciation for fashion. Via a touch-screen sapphire display, wearers can easily view content. Vibration-based alerts, a curated VIP contact list and customizable quick replies deliver notifications directly to the wrist – eliminating the need to fumble through a handbag or interrupt a meeting or event.

  • Messaging: MICA provides access to text messages and notifications of incoming mails from “important contacts” as designated in Gmail. Users can dismiss notifications from the device and respond with customizable quick replies.
  • Calendar and Event Notifications: MICA displays Google Calendar and Facebook event notifications while enabling users to accept or reject appointments.
  • Personal Concierge: MICA offers intelligent reminders, “Time to Go” (TTG), powered by TomTom and Intel, that dynamically adjust based on location to account for the time required to get to the next appointment. MICA also provides users with access to Yelp local search, which includes business ratings and reviews. MICA wearers can use Yelp to locate restaurants, shops and other local businesses nearby.
  • Priority Notifications: Users can curate a VIP contact list that filters notifications and text messages. Vibration-based alerts discreetly alert the wearer to incoming alerts.
  • Design: Elevating the appearance of traditional wearable devices, MICA’s cutting-edge design is constructed of premium finishes and 18K gold coating with a curved sapphire glass touch screen display. One style features black water snake skin, pearls from China and lapis stones from Madagascar, while the other style features white water snake skin, tiger’s eye from South Africa and obsidian from Russia.
  • Configuration and Security: The bracelet provides remote access and locking, the ability to locate the device, and configuration capabilities via a Web-based portal.
  • Two-Year AT&T Data Service Paid by Intel: MICA is connected by AT&T and includes a two-year wireless service plan provided by Intel in the price of the bracelet.

Pricing, Availability and Additional Product Information

  • Up to two days of battery life
  • Micro-USB charging
  • Available for sale only in the United States for $495

Video

About Opening Ceremony
Opening Ceremony, a multifaceted international retailer and fashion brand, was founded in September 2002 in New York by Carol Lim and Humberto Leon— with the idea of bringing their love of travel and fashion to a concept boutique. The company has grown to encompass several retail outlets in New York, Los Angeles, London and Tokyo, and the Opening Ceremony ready-to-wear, accessories and footwear collections for men and women. Opening Ceremony has also become known for its myriad of innovative collaborations, including with style icon Chloë Sevigny and filmmaker Spike Jonze. The company operates a wholesale showroom in New York representing over 20 international and domestic brands.

About Barneys New York
BARNEYS NEW YORK (Barneys) is a luxury specialty retailer renowned for having the most discerning edit from the world’s top designers, including women’s and men’s ready-to-wear, accessories, shoes, jewelry, cosmetics, fragrances, and gifts for the home. Barneys’ signature sense of wit and style is manifested in its creative advertising campaigns, original holiday themes, and celebrated window displays. Founded as a men’s retailer in 1923 in downtown Manhattan, it became an international arbiter of high style for both women and men in the 1970s, renowned for discovering and developing new and innovative design talent. Today, Barneys New York operates flagship stores in New York City, Beverly Hills, Chicago, Seattle, Boston, San Francisco, Las Vegas, Los Angeles and Scottsdale along with a preeminent luxury online store, Barneys.com, as well as 21 other stores and outlets across the United States. For more information about Barneys New York, please visit www.Barneys.com and explore its luxury content site, The Window, for an insider’s look into the Barneys world: a behind-the-scenes visit with exciting designers, fashion, events, and the Barneys team.

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com, and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

**Google, Gmail and Google Calendar are trademarks of Google Inc.

November 17 2014

Chip Shot: Intel Adds Family of Server Products to Meet Customer Needs

To support the recently announced Intel® Xeon® Processor E5-2600 v3 family, Intel is announcing the Intel® Server Product S2600TP Family of boards, chassis and spare/accessory SKUs. This product family joins the recently launched Intel&reg…

November 17 2014

Intel Reveals Details for Future High-Performance Computing System Building Blocks as Momentum Builds for Intel® Xeon Phi™ Product

Discloses Future Generation Intel Xeon Phi Processor and New Performance and Architectural Details for Intel® Omni-Path Fabric Interconnect Technology

SUPERCOMPUTING CONFERENCE (SC14), New Orleans, Nov. 17, 2014 – Intel Corporation todayannounced several new and enhanced technologies bolstering its leadership in high-performance computing (HPC). These include disclosure of the future generation Intel® Xeon Phi™ processor, code-named Knights Hill, and new architectural and performance details for Intel® Omni-Path Architecture, a new high-speed interconnect technology optimized for HPC deployments.

Intel also announced new software releases and collaborative efforts designed to make it easier for the HPC community to extract the full performance potential from current and future Intel industry-standard hardware.

Together, these new HPC building blocks and industry collaborations will help to address the dual challenges of extreme scalability and mainstream use of HPC while providing the foundation for a cost-effective path to exascale computing.

News Facts

  • Intel disclosed that its future, third-generation Intel Xeon Phi product family, code-named Knights Hill, will be built using Intel’s 10nm process technology and integrate Intel Omni-Path Fabric technology. Knights Hill will follow the upcoming Knights Landing product, with first commercial systems based on Knights Landing expected to begin shipping next year.
  • Industry investment in Intel Xeon Phi processors continues to grow with more than 50 providers expected to offer systems built using the new processor version of Knights Landing, with many more systems using the coprocessor PCIe card version of the product. To date, committed customer deals using the Knights Landing processor represent over 100 PFLOPS of system compute.
  • Recent high-profile Knights Landing deals include the Trinity supercomputer, a joint effort between Los Alamos and Sandia National Laboratories, and the Cori  supercomputer, announced by The U.S. Department of Energy’s (DOE) National Energy Research Scientific Computing (NERSC) Center. Additionally, DownUnder GeoSolutions a geosciences company, recently announced the largest commercial deployment of current-generation Intel Xeon Phi coprocessors, and the National Supercomputing Center IT4Innovations  announced a new supercomputer that will become the largest Intel Xeon Phi coprocessor-based cluster in Europe.
  • Intel disclosed that the Intel Omni-Path Architecture is expected to offer  100 Gbps line speed and up to 56 percent lower switch fabric latency in medium-to-large clusters than InfiniBand alternatives.1 The Intel Omni-Path Architecture will use a 48 port switch chip to deliver greater port density and system scaling compared to the current 36 port InfiniBand alternatives. Providing up to 33 percent more nodes per switch chip is expected to reduce the number of switches required, simplifying system design and reducing infrastructure costs at every scale. Expected system scaling benefits include:
    • Up to 1.3x greater port density than InfiniBand – enabling smaller clusters to maximize single switch investments.2
    • Use up to 50 percent fewer switches than a comparable InfiniBand-based cluster of medium- to large-size.3
    • Up to 2.3x higher scaling in a two-tier fabric configuration using the same number of switches as an InfiniBand-based cluster – allowing for more cost-effective scaling for very large cluster-based systems.4
  • Intel launched the Intel Fabric Builders Program to create an ecosystem working together to enable solutions based on the Intel Omni-Path Architecture. An expansion of the Intel Parallel Computing Centers was also announced, bringing the total to more than 40 centers in 13 countries working to modernize more than 70 of HPC’s most popular community codes.
  • Intel expanded its Lustre* software capabilities with the release of Intel® Enterprise Edition for Lustre software v2.2 and Intel® Foundation Edition for Lustre software. New appliances using the enhanced Intel® Solutions for Lustre software are currently being offered from Dell*, DataDirect Networks* and Dot Hill*.

Continued TOP500 Momentum

Intel-based systems account for 86 percent of all supercomputers and 97 percent of all new additions, according to the 44th edition of the TOP500 list announced today. In the two years since the introduction of the first-generation Intel Xeon Phi product family, these many-core, coprocessor-based systems represent 17 percent of the aggregated performance of all TOP500 supercomputers. The complete TOP500 list is available at www.top500.org.

Supporting Quotes

  • “Intel is excited about the strong market momentum and customer investment in the development of HPC systems based on current and future Intel Xeon Phi processors and high-speed fabric technology,” said Charles Wuischpard, vice president, Data Center Group, and general manager of Workstations and HPC at Intel. “The integration of these fundamental HPC building blocks, combined with an open standards-based programming model, will maximize HPC system performance, broaden accessibility and use, and serve as the on-ramp to exascale.”
  • “The combination of Intel Xeon Phi coprocessors with our proprietary software allows us to provide our customers with one of the most powerful geo-processing production systems to date,” said Dr. Matt Lamont, managing director, DownUnder GeoSolutions. “Our Intel Xeon Phi powered solutions enable interactive processing and imaging from each of our geophysicists’ individual computers. A testing regime that once took weeks can now be achieved in days. We’re thrilled with the Intel Xeon Phi coprocessors and look forward to evaluating the next-generation product.”

Supporting Resources

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com, and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, the Intel logo, Xeon and Intel Xeon Phi are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

1 Latency reductions based on Mellanox CS7500 Director Switch and Mellanox SB7700/SB7790 Edge switches compared to preliminary Intel simulations for Intel Omni-Path switches based on a 1024-node full bisectional bandwidth (FBB) Fat-Tree configuration (2-tier, 5 total switch hops), using a 48-port switch for Intel Omni-Path cluster and 36-port switch ASIC for either Mellanox or Intel® True Scale clusters.  Results have been estimated or simulated using internal Intel analysis or architecture simulation or modeling, and provided to you for informational purposes. Any differences in your system hardware, software or configuration may affect your actual performance.

2As compared to a shipping 36-port edge InfiniBand switch.

3 Reduction in up to ½ fewer switches claim based on a 1024-node full bisectional bandwidth (FBB) Fat-Tree configuration, using a 48-port switch for Intel Omni-Path cluster and 36-port switch ASIC for either Mellanox or Intel® True Scale clusters.

4 A2.3X based on 27,648 nodes based on a cluster configured with the Intel Omni-Path Architecture using 48-port switch ASICs, as compared with a 36-port switch chip that can support up to 11,664 nodes.