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G2 News

July 03 2013

Fortinet to Announce Second Quarter 2013 Financial Results

Fortinet to Announce Second Quarter 2013 Financial Results …read more Via: Shareholder

July 02 2013

Nine HIPAA Network Considerations

The Health Insurance Portability and Accountability Act of 1996 (HIPAA) Omnibus Final Rule, released January 2013, introduced some significant changes [...] …read more Via: Cisco Security Blog

July 01 2013

Chip Shot: Intel® System Studio Extended to Linux* Embedded App Developers

Intel is expanding its Intel

Industry News

August 28 2014

You’re Only as Secure as Your Weakest Link: Operationalizing Security

I am reminded of the wisdom of the old saw that “no news is good news” as almost every day [...]

August 27 2014

Intel Announces New Packaging and Test Technologies for Foundry Customers

New Technologies to Improve Time to Market and Reduce Costs

SANTA CLARA, Calif., Aug. 27, 2014 – Intel Corporation today announced two new technologies for Intel Custom Foundry customers that need cost-effective advanced packaging and test technologies.

Embedded Multi-die Interconnect Bridge (EMIB), available to 14nm foundry customers, is a breakthrough that enables a lower cost and simpler 2.5D packaging approach for very high density interconnects between heterogeneous dies on a single package. Instead of an expensive silicon interposer with TSV (through silicon via), a small silicon bridge chip is embedded in the package, enabling very high density die-to-die connections only where needed. Standard flip-chip assembly is used for robust power delivery and to connect high-speed signals directly from chip to the package substrate. EMIB eliminates the need for TSVs and specialized interposer silicon that add complexity and cost.

“The EMIB technology enables new on-package functionality that may have been too costly to pursue with previous solutions,” said Babak Sabi, Intel vice president and director, Assembly and Test Technology Development.

Intel also announced the availability of its revolutionary High Density Modular Test (HDMT) platform. HDMT, a combination of hardware and software modules, is Intel’s test technology platform that targets a range of products in diverse markets including server, client, system on chip, and Internet of Things. Until now, this capability was only available internally for Intel products. Today’s announcement makes HDMT available to customers of Intel Custom Foundry.

“We developed the HDMT platform to enable rapid test development and unit-level process control. This proven capability significantly reduces costs compared to traditional test platforms. HDMT reduces time to market and improves productivity as it uses a common platform from low-volume product debug up to high-volume production,” said Sabi.

EMIB is available to foundry customers for product sampling in 2015 and HDMT is available immediately.

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

August 27 2014

Chip Shot: India’s Flipkart Launches Five New Tablets Powered by Intel

flipkart_tablet.jpgFlipkart, one of India’s largest e-commerce marketplaces, announced five new tablets under its brand Digiflip Pro powered by Intel® Atom™ Processors. The tablets include two 8”, two 9” and a 7” tablet and will be exclusively available on www.flipkart.com. These new Intel-based tablets offer amazing features, graphics, great performance with long battery life, all packed into sleek form factors.

August 27 2014

Chip Shot: Intel Brings Technology Innovation Accelerated Awards Back to IDF

At the 2014 Intel Developer Forum (IDF) in San Francisco, held September 9-11, Intel will re-instate its annual Technology Innovation Accelerated (TIA) Awards. The Intel TIA Awards recognizes the best innovations based on the latest Intel technologies across 10 categories. In addition to category winners, three best of show winners will be selected for each award group – Hardware, Software & Services and Combined Solutions. Award finalists will be determined by a panel of judges and announced on September 9. Winners will be determined by participating press and analysts and announced on the evening of September 10 at the IDF Technology Showcase.

August 27 2014

Social Engineering:
 Finding the Weak Links In-Person

An enterprise can pay hundreds of thousands of dollars or more for the latest security software and imagine itself protected [...]