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November 17 2014

Chip Shot: Intel Adds Family of Server Products to Meet Customer Needs

To support the recently announced Intel® Xeon® Processor E5-2600 v3 family, Intel is announcing the Intel® Server Product S2600TP Family of boards, chassis and spare/accessory SKUs. This product family joins the recently launched Intel&reg…

November 17 2014

Intel Reveals Details for Future High-Performance Computing System Building Blocks as Momentum Builds for Intel® Xeon Phi™ Product

Discloses Future Generation Intel Xeon Phi Processor and New Performance and Architectural Details for Intel® Omni-Path Fabric Interconnect Technology

SUPERCOMPUTING CONFERENCE (SC14), New Orleans, Nov. 17, 2014 – Intel Corporation todayannounced several new and enhanced technologies bolstering its leadership in high-performance computing (HPC). These include disclosure of the future generation Intel® Xeon Phi™ processor, code-named Knights Hill, and new architectural and performance details for Intel® Omni-Path Architecture, a new high-speed interconnect technology optimized for HPC deployments.

Intel also announced new software releases and collaborative efforts designed to make it easier for the HPC community to extract the full performance potential from current and future Intel industry-standard hardware.

Together, these new HPC building blocks and industry collaborations will help to address the dual challenges of extreme scalability and mainstream use of HPC while providing the foundation for a cost-effective path to exascale computing.

News Facts

  • Intel disclosed that its future, third-generation Intel Xeon Phi product family, code-named Knights Hill, will be built using Intel’s 10nm process technology and integrate Intel Omni-Path Fabric technology. Knights Hill will follow the upcoming Knights Landing product, with first commercial systems based on Knights Landing expected to begin shipping next year.
  • Industry investment in Intel Xeon Phi processors continues to grow with more than 50 providers expected to offer systems built using the new processor version of Knights Landing, with many more systems using the coprocessor PCIe card version of the product. To date, committed customer deals using the Knights Landing processor represent over 100 PFLOPS of system compute.
  • Recent high-profile Knights Landing deals include the Trinity supercomputer, a joint effort between Los Alamos and Sandia National Laboratories, and the Cori  supercomputer, announced by The U.S. Department of Energy’s (DOE) National Energy Research Scientific Computing (NERSC) Center. Additionally, DownUnder GeoSolutions a geosciences company, recently announced the largest commercial deployment of current-generation Intel Xeon Phi coprocessors, and the National Supercomputing Center IT4Innovations  announced a new supercomputer that will become the largest Intel Xeon Phi coprocessor-based cluster in Europe.
  • Intel disclosed that the Intel Omni-Path Architecture is expected to offer  100 Gbps line speed and up to 56 percent lower switch fabric latency in medium-to-large clusters than InfiniBand alternatives.1 The Intel Omni-Path Architecture will use a 48 port switch chip to deliver greater port density and system scaling compared to the current 36 port InfiniBand alternatives. Providing up to 33 percent more nodes per switch chip is expected to reduce the number of switches required, simplifying system design and reducing infrastructure costs at every scale. Expected system scaling benefits include:
    • Up to 1.3x greater port density than InfiniBand – enabling smaller clusters to maximize single switch investments.2
    • Use up to 50 percent fewer switches than a comparable InfiniBand-based cluster of medium- to large-size.3
    • Up to 2.3x higher scaling in a two-tier fabric configuration using the same number of switches as an InfiniBand-based cluster – allowing for more cost-effective scaling for very large cluster-based systems.4
  • Intel launched the Intel Fabric Builders Program to create an ecosystem working together to enable solutions based on the Intel Omni-Path Architecture. An expansion of the Intel Parallel Computing Centers was also announced, bringing the total to more than 40 centers in 13 countries working to modernize more than 70 of HPC’s most popular community codes.
  • Intel expanded its Lustre* software capabilities with the release of Intel® Enterprise Edition for Lustre software v2.2 and Intel® Foundation Edition for Lustre software. New appliances using the enhanced Intel® Solutions for Lustre software are currently being offered from Dell*, DataDirect Networks* and Dot Hill*.

Continued TOP500 Momentum

Intel-based systems account for 86 percent of all supercomputers and 97 percent of all new additions, according to the 44th edition of the TOP500 list announced today. In the two years since the introduction of the first-generation Intel Xeon Phi product family, these many-core, coprocessor-based systems represent 17 percent of the aggregated performance of all TOP500 supercomputers. The complete TOP500 list is available at www.top500.org.

Supporting Quotes

  • “Intel is excited about the strong market momentum and customer investment in the development of HPC systems based on current and future Intel Xeon Phi processors and high-speed fabric technology,” said Charles Wuischpard, vice president, Data Center Group, and general manager of Workstations and HPC at Intel. “The integration of these fundamental HPC building blocks, combined with an open standards-based programming model, will maximize HPC system performance, broaden accessibility and use, and serve as the on-ramp to exascale.”
  • “The combination of Intel Xeon Phi coprocessors with our proprietary software allows us to provide our customers with one of the most powerful geo-processing production systems to date,” said Dr. Matt Lamont, managing director, DownUnder GeoSolutions. “Our Intel Xeon Phi powered solutions enable interactive processing and imaging from each of our geophysicists’ individual computers. A testing regime that once took weeks can now be achieved in days. We’re thrilled with the Intel Xeon Phi coprocessors and look forward to evaluating the next-generation product.”

Supporting Resources

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com, and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, the Intel logo, Xeon and Intel Xeon Phi are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

1 Latency reductions based on Mellanox CS7500 Director Switch and Mellanox SB7700/SB7790 Edge switches compared to preliminary Intel simulations for Intel Omni-Path switches based on a 1024-node full bisectional bandwidth (FBB) Fat-Tree configuration (2-tier, 5 total switch hops), using a 48-port switch for Intel Omni-Path cluster and 36-port switch ASIC for either Mellanox or Intel® True Scale clusters.  Results have been estimated or simulated using internal Intel analysis or architecture simulation or modeling, and provided to you for informational purposes. Any differences in your system hardware, software or configuration may affect your actual performance.

2As compared to a shipping 36-port edge InfiniBand switch.

3 Reduction in up to ½ fewer switches claim based on a 1024-node full bisectional bandwidth (FBB) Fat-Tree configuration, using a 48-port switch for Intel Omni-Path cluster and 36-port switch ASIC for either Mellanox or Intel® True Scale clusters.

4 A2.3X based on 27,648 nodes based on a cluster configured with the Intel Omni-Path Architecture using 48-port switch ASICs, as compared with a 36-port switch chip that can support up to 11,664 nodes.

October 30 2014

Chip Shot: Microsoft and Intel Announce Collaboration at Open Compute EU Summit

Today at the Open Compute Project (OCP) European Summit, Microsoft announced the contribution of the 2nd generation Open CloudServer (OCSv2) specification to the OCP. Through a joint engineering collaboration with Intel, the companies have developed a…

October 23 2014

Chip Shot: Intel® Xeon® Processors Power New HP Moonshot Offerings

HP today announced two new HP ProLiant Moonshot server cartridges featuring Intel processors. Powered by Intel’s 2nd generation 64-bit Intel® Atom® processor based SoCs, the HP ProLiant m350 underscores Intel’s 64-bit SoC market and technology leadership by delivering the highest density available in the Moonshot family. The new HP ProLiant m710 server features the Intel® Xeon® E3-1284L v3 processor with built-in Intel® Iris Pro Graphics P5200. The products are another example of Intel providing customized solutions for its partners to address specific workloads. Customers can choose from server options that have been optimized to deliver unmatched performance density for workloads ranging from video transcoding and virtual application delivery to static web hosting. For additional information, view the Intel blogs.

October 20 2014

Chip Shot: Intel® Xeon® E5 v3 Server Processors Power New Microsoft Azure G-series

Today Microsoft announced the new Azure “G-series” – designed to deliver the most powerful VM sizes available in the public cloud. The G-series is powered by a high performance, customized SKU of the latest Intel® Xeon® E5 v3 processor. Customers will have access to up to 32 cores, 448GB RAM and over 6TB of local SSD storage, providing significant performance gains relative to existing VM sizes. The new G-series will benefit customers running large SQL, Oracle and MongoDB databases, big data workloads and enterprise applications that demand powerful processing along with large memory and fast disk performance. For more information, read the Intel blog.

September 17 2014

Chip Shot: Intel Brings World-Class Supercomputing Power to UNLV Researchers

Switch SUPERNAP and Intel today announced they are working with UNLV to make the Intel “Cherry Creek” supercomputer available to UNLV researchers. The Cherry Creek supercomputer is among the world’s fastest and most powerful supercomputers. It is housed in Switch’s Las Vegas SUPERNAP data center and is available to UNLV researchers through SUPERNAP’s connectivity network. Cherry Creek uses a combination of Intel® Xeon® processors, Xeon Phi™ coprocessors and Intel® True Scale Fabric to process data roughly seven times faster than UNLV’s supercomputing center currently allows. It will act as a catalyst for scientific discovery, the modernization of applications and regional economic development efforts.

September 17 2014

Chip Shot: Intel Graphics Momentum Showcased at IDF, and the Future’s Even More ‘Visual’

Last week at IDF Intel showed developers the latest and greatest in Intel® processor graphics technologies. Intel is the number one PC Graphics company by volume according to the latest Q3 ’14 Mercury Research study, and developers attended dozens of IDF sessions and demos last week to get an update. Key news around OpenCL 2.0 support in our new Intel® Core™ M processor family, ‘Gen8’ graphics architecture, Intel® Wireless Display, and high-performance Intel® Iris™ and Iris™ Pro graphics was disclosed. Read more here.

September 08 2014

Chip Shot: New Intel® Xeon® Processors Accelerates Data Center Transformation

To meet the rapidly evolving needs of data centers, Intel today introduced the Intel® Xeon® processor E5-2600/1600 v3 product families. Setting 27 new performance world-records, with increases of up to 3x compared with previous generation, and…

September 08 2014

Latest Intel® Xeon® Processors Accelerate Data Center Transformation for the Digital Services Era

New Technologies Provide a Range of Capabilities and Are Central to Enabling a Software Defined Infrastructure

NEWS HIGHLIGHTS

  • New monitoring and management features aid rapid, automated deployment of workloads, increase efficiency and improve service quality.
  • Provides leadership performance for compute, storage and network workloads to enable efficient and dynamic operation in cloud environments.
  • Twenty-seven new performance world records1, with increases up to 3x compared with previous generation2.
  • Up to 50 percent more cores and cache3 than the previous generation, and first-ever server platform supporting DDR4 memory for improved application performance.

E5-2600_v3_9a.jpg

SANTA CLARA, Calif., Sept. 8, 2014 – Intel Corporation today introduced the Intel® Xeon® processor E5-2600/1600 v3 product families to address the requirements of diverse workloads and the rapidly evolving needs of data centers. The new processor families include numerous enhancements that provide performance increases of up to 3x over the previous generation2, world-class energy efficiency and enhanced security. To facilitate the explosive demand for software defined infrastructure (SDI), the processors expose key metrics, through telemetry, which enable the infrastructure to deliver services with the best performance, resilience and optimized total cost of ownership.

The processors will be used in servers, workstations, storage and networking infrastructure to power a broad set of workloads such as data analytics, high-performance computing, telecommunications and cloud-based services, as well as back-end processing for the Internet of Things.

“The digital services economy imposes new requirements on the data center, requirements for automated, dynamic and scalable service delivery,” said Diane Bryant, senior vice president and general manager of the Data Center Group at Intel. “Our new Intel processors deliver unmatched performance, energy efficiency and security, as well as provide visibility into the hardware resources required to enable software defined infrastructure. By enabling the re-architecture of the data center, Intel is helping companies fully exploit the benefits of cloud-based services.”

Enabling Software Defined Infrastructure
Software defined infrastructure (SDI) is the foundation for cloud computing. The digital services economy requires agility and scale that demands all infrastructure resources be programmable and highly configurable. These abilities, coupled with telemetry, analytics, and automated actions, allow the data center to become highly optimized. Intel continues to invest in delivering this vision of an automated data center, and with the new Xeon E5-2600 v3 product family, the company has introduced key sensors and telemetry that further enhance SDI.

The Intel Xeon processor E5-2600 v3 product family introduce new features that provide greater visibility into the system than ever before. A new cache monitoring feature provides data to enable orchestration tools to intelligently place and rebalance workloads resulting in faster completion times. This also provides the ability to conduct analysis of performance anomalies due to competition for cache in a multitenant cloud environment where there is little visibility into what workloads consumers are running.

The new processors also include platform telemetry sensors and metrics for CPU, memory and I/O utilization. With the addition of thermal sensors for airflow and outlet temperature, the visibility and control has increased significantly from the prior generation. The processors offer a holistic set of sensors and telemetry for any SDI orchestration solution to more closely monitor, manage and control system utilization to help maximize data center efficiency for a lower total cost of ownership.

Increased Performance and Energy Efficiency
With up to 18 cores per socket and 45MB of last-level cache, the Intel Xeon E5-2600 v3 product family provides up to 50 percent more cores and cache compared to the previous generation processors. In addition, an extension to Intel® Advanced Vector Extensions 2 (Intel AVX2)4 doubles the width of vector integer instructions to 256 bits per clock cycle for integer sensitive workloads and delivers up to 1.9x higher performance gains5.

The Xeon E5-2600 v3 product family also increases virtualization density, allowing support for up to 70 percent more VMs per server compared to the previous generation processors6, which helps to reduce data center operational expenses. Memory bandwidth constrained workloads will gain up to 1.4x higher performance compared to the previous generation7 with the support of next-generation DDR4 memory. Intel Advanced Encryption Standard New Instructions (Intel® AES-NI) have also been enhanced to accelerate data encryption and decryption by up to 2x without sacrificing application response times8.

The processors are built using Intel’s industry-leading and energy-efficient 22nm, 3-D Tri-Gate technology, cutting power consumption while boosting performance of transistors. The new “per-core” power states dynamically regulate and adjust power in each processor core for more power-efficient workload processing.

Combining both record performance and advanced efficiency features, the Intel Xeon processor E5-2600 v3 product family sets a new world record for server energy efficiency9 based on performance per watt.

Creating Open, Flexible Networks with Intel Xeon E5-2600 v3 Processors
Intel Xeon E5-2600 v3 processors can be paired with the Intel® Communications Chipset 89xx series featuring Intel® Quick Assist Technology to enable faster encryption and compression performance10 to improve security in a wide range of workloads. Service providers and networking equipment providers can use the platform to consolidate multiple communications workloads onto a single, standardized and flexible architecture to speed up services deployment, reduce costs, and create a more consistent and secure user experience.

In addition, the new Intel® Ethernet Controller XL710 family helps address the increasing demands on networks with capabilities to enable better performance for virtualized servers and networks. The flexible 10/40 gigabit Ethernet controller provides twice the bandwidth while consuming half the power compared with the previous generation11.

Extensive industry support
Starting today, system manufacturers from around the world are expected to announce hundreds of Intel® Xeon® processor E5 v3 family-based platforms. These manufacturers across servers, storage and networking include Bull*, Cray*, Cisco*, Dell*, Fujitsu*, Hitachi*, HP*, Huawei*, IBM*, Inspur*, Lenovo*, NEC*, Oracle*, Quanta*, Radisys*, SGI*, Sugon* and Supermicro*, among many others.

Pricing details
The Intel Xeon processor E5-2600 v3 product family will be offered with 26 different parts that range in price from $213 to $2,702 in quantities of 1,000. Intel Xeon processor E5-1600 workstations will be offered with six different parts in prices ranging from $295 to $1,723. Complete pricing details can be found in the Intel Newsroom. For more details on these new Intel Xeon processors, visit the online press kit.

View the Multimedia Press Kit
(includes the full story with high resolution photos, videos, quotes, fact sheets, and more)

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

Results have been measured by Intel based on software, benchmark or other data of third parties and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. Intel does not control or audit the design or implementation of third party data referenced in this document. Intel encourages all of its customers to visit the websites of the referenced third parties or other sources to confirm whether the referenced data is accurate and reflects performance of systems available for purchase.

1 Twenty-seven performance world records based on two-socket configurations. Source as of Sept. 8, 2014. Full details available at: http://www.intel.com/content/www/us/en/benchmarks/server/xeon-e5-2600-v3/xeon-e5-2600-v3-summary.html.

2 Source as of Sep. 8, 2014. New configuration: Hewlett-Packard Company HP ProLiant ML350 Gen9 platform with two Intel Xeon Processor E5-2699 v3, Oracle Java Standard Edition 8 update 11, 190,674 SPECjbb2013-MultiJVM max-jOPS, 47,139 SPECjbb2013-MultiJVM critical-jOPS. Source. Baseline: Cisco Systems Cisco UCS C240 M3 platform with two Intel Xeon Processor E5-2697 v2, Oracle Java Standard Edition 7 update 45, 63,079 SPECjbb2013-MultiJVM max-jOPS , 23,797 SPECjbb2013-MultiJVM critical-jOPS. Source.

3 Intel® Xeon® Processor E5-2699 v3 (18C, 45M Cache) compared to Intel® Xeon® Processor E5-2697 v2 (12C, 30M Cache).

4 Intel® Advanced Vector Extensions (Intel® AVX)* provides higher throughput to certain processor operations. Due to varying processor power characteristics, utilizing AVX instructions may cause a) some parts to operate at less than the rated frequency and b) some parts with Intel® Turbo Boost Technology 2.0 to not achieve any or maximum turbo frequencies. Performance varies depending on hardware, software, and system configuration and you can learn more at http://www.intel.com/go/turbo.

5 Source as of August 2014 TR#3034 on Linpack*. Baseline configuration: Intel® Server Board S2600CP with two Intel® Xeon® Processor E5-2697 v2, Intel® HT Technology disabled, Intel® Turbo Boost Technology enabled, 8x8GB DDR3-1866, RHEL* 6.3, Intel® MKL 11.0.5, score: 528 GFlops. New configuration: Intel® Server System R2208WTTYS with two Intel® Xeon® Processor E5-2699 v3, Intel® HT Technology disabled, Intel® Turbo Boost Technology enabled, 8x16GB DDR4-2133, RHEL* 6.4, Intel® MKL 11.1.1, score: 1,012 GFlops

6 Source as of Sept. 8, 2014. New configuration: Hewlett-Packard Company ProLiant DL360 Gen9 with two Intel Xeon Processor E5-2699 v3, SPECvirt_sc2013 1614 @ 95 VMs. Source.  Baseline: IBM System x3650 M4 platform with two Intel Xeon Processor E5-2697 v2, SPECvirt_sc2013 947.0 @ 53 VMs. Source.

7 Source as of August 2014 TR#3044 on STREAM (triad): Intel® Server Board S2600CP with two Intel® Xeon® Processor E5-2697 v2, 24x16GB DDR3-1866 @1066MHz DR-RDIMM, score: 58.9 GB/sec. New Configuration: Intel® Server System R2208WTTYS with two Intel® Xeon® Processor E5-2699 v3, 24x16GB DR4-2133 @ 1600MHz DR-RDIMM, score: 85.2 GB/sec.

8 Source as of June 2014 on AES-128-GCM Encryption algorithm: Intel internal measurements using Intel® Server Board S2600CW2S with two Intel® Xeon® Processor E5-2658 v3, DDR4-2133, CentoOS v3.8.4, Open SSL v1.0.2-beta1. Baseline Configuration: Intel internal measurements with two E5-2658 v2, DDR3-1866, CentoOS v3.8.4, Open SSL v1.0.2-beta1.

9 Comparison based onSPECpower_ssj2008 results published (http://www.spec.org/) as of Aug. 26, 2014. Sugon I620-G20 platform with two Intel Xeon Processor E5-2699 v3, IBM J9 VM, 10,599 overall ssj_ops/watt. Source (http://www.sugon.com/).

10 Intel® Communications Chipset 8920 (20Gbps) compared to Intel Communication Chipset 8955 (50Gbps) capable of up to 2.5x more encryption acceleration. Intel® Communications Chipset 8920 (8Gbps) compared to Intel Communication Chipset 8955 (24Gbps) capable of up to 3x more compression acceleration. 8920 Configuration: C8920 PCIe x16 QA Driver/SDK Release 1.0.0-77 Stargo/ Gladden 4C-8T-8 MB LLC – 2GHz, 2C-4T used for peak CCK throughputs. 8955 Configuration: [8955 PCIe x16 on a Shumway development Platform with Ivy Bridge EP CPUs and QA Driver/SDK 1.00. Tests were performed using UP/8 cores; Measured by Intel].

11 Source as of Aug 2014: Calculated Gb/Watt for 2@ Intel Ethernet CNA X520-DA2 Dual-port Twinax Typical Power 11.6W 2: 1@ Intel Ethernet CNA X710-DA4 Quad-port Twinax Typical Power 3.4W for a 222% increase in Gb/Watt (Typical).

September 02 2014

Intel® Xeon® Processor E5-2600/1600 v3 Product Family

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