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April 19 2015

Chip Shot: Moore’s Law Turns 50 Today

Today marks the 50th anniversary of Moore’s Law, an unspoken agreement between the electronics industry and the world economy that inspires engineers, inventors and entrepreneurs to think about what is possible. Moore’s Law enables much of today’s innovation – wearable technology, genomic sequencing, smart cities –and is helping industries tackle seemingly intractable problems and turning fantastic ideas into profitable business ventures. What will the next 50 years hold?

April 09 2015

Chip Shot: Intel Selected by U.S. Department of Energy to Deliver Nation’s Most Powerful Supercomputer

Today Intel announced the U.S. Department of Energy’s (DOE) Argonne Leadership Computing Facility has awarded Intel Federal LLC, a wholly-owned subsidiary of Intel Corporation, a contract to deliver two next-generation supercomputers at Argonne Nation…

April 09 2015

U.S. Department of Energy Selects Intel to Deliver Nation’s Most Powerful Supercomputer at Argonne National Laboratory

180 Petaflops System Based on Intel’s HPC Scalable System Framework to Advance Scientific Research and Discovery

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Intel Selected by U.S. Department of Energy to Deliver Nation’s Most Powerful Supercomputer

SANTA CLARA, Calif., April 9, 2015 – Intel Corporation today announced that the U.S. Department of Energy’s (DOE) Argonne Leadership Computing Facility (ALCF) has awarded Intel Federal LLC, a wholly-owned subsidiary of Intel Corporation, a contract to deliver two next-generation supercomputers to Argonne National Laboratory.

The contract is part of the DOE’s multimillion dollar initiative to build state-of-the-art supercomputers at Argonne, Lawrence Livermore and Oak Ridge National Laboratories that will be five to seven times more powerful than today’s top supercomputers. The joint Collaboration of Oak Ridge, Argonne and Lawrence Livermore (CORAL) will help to advance U.S. leadership in scientific research and maintain its position at the forefront of next-generation exascale computing for years to come.

Intel was selected as the prime contractor and will work with Cray Inc. as the system integrator and manufacturer of these next-generation high-performance computing (HPC) systems for the ALCF. The largest system, to be called Aurora, is based on Intel’s HPC scalable system framework and will be a next-generation Cray “Shasta” supercomputer. The Aurora system will be delivered in 2018 and have a peak performance of 180 petaflops, making it the world’s most powerful system currently announced to date.

A second system, to be named Theta, will serve as an early production system for the ALCF. To be delivered in the 2016, the system will provide performance of 8.5 petaflops while requiring only 1.7 megawatts of power.

“The selection of Intel to deliver the Aurora supercomputer is validation of our unique position to lead a new era in HPC,” said Raj Hazra, vice president, Data Center Group and general manager, Technical Computing Group at Intel. “Intel’s HPC scalable system framework enables balanced, scalable and efficient systems while extending the ecosystem’s decades of software investment to future generations. We look forward to the numerous scientific discoveries and the far-reaching impacts on society that Aurora will enable.”

News Facts

  • Intel selected as prime contractor to deliver 180 petaflops supercomputer at the ALCF, marking the first time in nearly two decades that Intel is taking the prime contractor role in the delivery of a supercomputer.1
  • The Aurora system will be 18 times more powerful than its predecessor, Mira, while utilizing only 2.7 times the energy usage.2
  • Research goals for the Aurora system include: more powerful, efficient and durable batteries and solar panels; improved biofuels and more effective disease control; improving transportation systems and enabling production of more highly efficient and quieter engines; and wind turbine design and placement for improved efficiency and reduced noise.
  • Contracts valued at more than $200 million are in addition to the recent selections of Intel architecture for the DOE’s next-generation Trinity and Cori  supercomputers.
  • Aurora will be based on Intel’s scalable system framework combining multiple Intel HPC building blocks, including future generations of Intel® Xeon Phi™ processors and the Intel® Omni-Path Fabric high-speed interconnect technology, a new non-volatile memory architecture and advanced file system storage using Intel® Lustre* software.
  • The Theta system will be powered by Intel® Xeon® processors and next-generation Intel Xeon Phi processors, code-named Knights Landing, and will be based on the next-generation Cray XC supercomputer.

Intel’s HPC Scalable System Framework
The Aurora supercomputer represents a new architectural direction based on Intel’s HPC scalable system framework. The framework is a flexible blueprint for developing high-performance, balanced, power-efficient and reliable systems capable of supporting both compute- and data-intensive workloads. The framework combines next-generation Intel Xeon and Xeon Phi processors, Intel Omni-Path Fabric, innovative memory technologies, Intel® Silicon Photonics Technology and the Intel Lustre parallel file system – with the ability to efficiently integrate these components into a broad spectrum of HPC system solutions. The framework also provides a ubiquitous and standards-based programming model, extending the ecosystem’s current investments in existing code for future generations.

Supporting Quotes

  • “Argonne’s decision to utilize Intel’s HPC scalable system framework stems from the fact it is designed to deliver a well-balanced and adaptable system capable of supporting both compute-intensive and data-intensive workloads,” said Rick Stevens, associate laboratory director for Argonne National Laboratory. “We look forward to collaborating with both Intel and Cray on this important project that will be critically important to U.S. high-performance computing efforts for years to come.”
  • “The Aurora system will be one of the most advanced supercomputers ever built, and Cray is honored and proud to be collaborating with two great partners in Intel and Argonne National Lab,” said Peter Ungaro, president and CEO of Cray. “The combination of Cray’s vast experience in building some of the world’s largest and most productive supercomputers, combined with Intel’s cutting-edge technologies will provide the ALCF with a leadership-class system that will be ready for advancing scientific discovery from day one.”

Supporting Resources

Interactive Photo Capsule

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, the Intel logo, Xeon and Intel Xeon Phi, Omni-Path Fabric and Silicon Photonics are trademarks of Intel Corporation in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Results have been estimated or simulated using internal Intel analysis or architecture simulation or modeling, and provided to you for informational purposes. Any differences in your system hardware, software or configuration may affect your actual performance.

1 ASCI Red at the Sandia National Laboratory

2 The ALCF’s current Mira system delivers a peak performance of 10 petaflops and a peak power consumption of 4.8 megawatts. The Aurora system will have a peak performance of 180 petaflops and a peak power consumption of 13 megawatts.

April 03 2015

Celebrating the 50th Anniversary of Moore’s Law

Marking the 50th anniversary of Intel co-founder Gordon Moore’s seminal paper, today Intel leads the industry in celebrating the profound impact that Moore’s Law has had on our world. Moore’s Law has continued to drive staggeringly fast progress in computing technology to deliver unprecedented economic benefits and societal changes.

March 10 2015

Chip Shot: Intel Announces Collaborations with Facebook and Others at Open Compute Summit

Today at the OCP US Summit, Intel and Facebook announced a collaboration to develop a new Open Compute Project (OCP)-based server design. The Facebook contributed design uses a server card based on the new Intel® Xeon® processor D product family, the first Xeon system-on-chip (SoC) and first Intel Xeon processor based on 14nm process technology. Intel also announced that it is working with Penguin Computing on the first Intel® Xeon Phi™ processor, code-named Knights Landing, powered HPC system based on an OCP rack design. The announcements were made by Intel’s keynote speaker Jason Waxman, general manager, Cloud Platforms Group. Read Jason’s blog for more information on Intel at OCP.

February 04 2015

Chip Shot: Intel® Xeon® Processors in the Cloud Contributes to Music Boom

According to Nielsen industry data, on-demand streaming grew 54% in 2014 with over 164 billion songs streamed through audio and video platforms, thanks in large part to cloud computing powered by Intel® Xeon® processor-based platforms. Intel technology helps allow consumers to access, download, store and share their music quickly and reliably – whether at home or on the go. Take a look below at how consumers use technology to put a new spin on their music experience.

Infographic: Where do you find your groove?

Music Infographic teaser

January 16 2015

Chip Shot: Intel® Xeon® Processor E7 v2 Family Awarded Best Server Processor of 2014

Today, The Linley Group recognized the Intel® Xeon® processor E7 v2 family as the Best PC or Server Processor of 2014 in its annual Analysts’ Choice Awards. According to The Linley Group, the Xeon E7v2 family was selected as the clear choice as it represents the greatest performance gains for customers. Offering a huge improvement for scalable servers, the Xeon E7v2 family upgrades the processor core, north-bridge microarchitecture, and system platform simultaneously and using Intel’s 22nm FinFET technology. Used by customers such as eBay and the London Stock Exchange, the processor family offers twice the compute performance, three times the memory capacity, and four times the I/O bandwidth of its predecessor while offering advanced RAS features for high reliability and uptime. Check out The Linley Group press release for more information.

November 17 2014

Chip Shot: Intel Adds Family of Server Products to Meet Customer Needs

To support the recently announced Intel® Xeon® Processor E5-2600 v3 family, Intel is announcing the Intel® Server Product S2600TP Family of boards, chassis and spare/accessory SKUs. This product family joins the recently launched Intel&reg…

November 17 2014

Intel Reveals Details for Future High-Performance Computing System Building Blocks as Momentum Builds for Intel® Xeon Phi™ Product

Discloses Future Generation Intel Xeon Phi Processor and New Performance and Architectural Details for Intel® Omni-Path Fabric Interconnect Technology

SUPERCOMPUTING CONFERENCE (SC14), New Orleans, Nov. 17, 2014 – Intel Corporation todayannounced several new and enhanced technologies bolstering its leadership in high-performance computing (HPC). These include disclosure of the future generation Intel® Xeon Phi™ processor, code-named Knights Hill, and new architectural and performance details for Intel® Omni-Path Architecture, a new high-speed interconnect technology optimized for HPC deployments.

Intel also announced new software releases and collaborative efforts designed to make it easier for the HPC community to extract the full performance potential from current and future Intel industry-standard hardware.

Together, these new HPC building blocks and industry collaborations will help to address the dual challenges of extreme scalability and mainstream use of HPC while providing the foundation for a cost-effective path to exascale computing.

News Facts

  • Intel disclosed that its future, third-generation Intel Xeon Phi product family, code-named Knights Hill, will be built using Intel’s 10nm process technology and integrate Intel Omni-Path Fabric technology. Knights Hill will follow the upcoming Knights Landing product, with first commercial systems based on Knights Landing expected to begin shipping next year.
  • Industry investment in Intel Xeon Phi processors continues to grow with more than 50 providers expected to offer systems built using the new processor version of Knights Landing, with many more systems using the coprocessor PCIe card version of the product. To date, committed customer deals using the Knights Landing processor represent over 100 PFLOPS of system compute.
  • Recent high-profile Knights Landing deals include the Trinity supercomputer, a joint effort between Los Alamos and Sandia National Laboratories, and the Cori  supercomputer, announced by The U.S. Department of Energy’s (DOE) National Energy Research Scientific Computing (NERSC) Center. Additionally, DownUnder GeoSolutions a geosciences company, recently announced the largest commercial deployment of current-generation Intel Xeon Phi coprocessors, and the National Supercomputing Center IT4Innovations  announced a new supercomputer that will become the largest Intel Xeon Phi coprocessor-based cluster in Europe.
  • Intel disclosed that the Intel Omni-Path Architecture is expected to offer  100 Gbps line speed and up to 56 percent lower switch fabric latency in medium-to-large clusters than InfiniBand alternatives.1 The Intel Omni-Path Architecture will use a 48 port switch chip to deliver greater port density and system scaling compared to the current 36 port InfiniBand alternatives. Providing up to 33 percent more nodes per switch chip is expected to reduce the number of switches required, simplifying system design and reducing infrastructure costs at every scale. Expected system scaling benefits include:
    • Up to 1.3x greater port density than InfiniBand – enabling smaller clusters to maximize single switch investments.2
    • Use up to 50 percent fewer switches than a comparable InfiniBand-based cluster of medium- to large-size.3
    • Up to 2.3x higher scaling in a two-tier fabric configuration using the same number of switches as an InfiniBand-based cluster – allowing for more cost-effective scaling for very large cluster-based systems.4
  • Intel launched the Intel Fabric Builders Program to create an ecosystem working together to enable solutions based on the Intel Omni-Path Architecture. An expansion of the Intel Parallel Computing Centers was also announced, bringing the total to more than 40 centers in 13 countries working to modernize more than 70 of HPC’s most popular community codes.
  • Intel expanded its Lustre* software capabilities with the release of Intel® Enterprise Edition for Lustre software v2.2 and Intel® Foundation Edition for Lustre software. New appliances using the enhanced Intel® Solutions for Lustre software are currently being offered from Dell*, DataDirect Networks* and Dot Hill*.

Continued TOP500 Momentum

Intel-based systems account for 86 percent of all supercomputers and 97 percent of all new additions, according to the 44th edition of the TOP500 list announced today. In the two years since the introduction of the first-generation Intel Xeon Phi product family, these many-core, coprocessor-based systems represent 17 percent of the aggregated performance of all TOP500 supercomputers. The complete TOP500 list is available at www.top500.org.

Supporting Quotes

  • “Intel is excited about the strong market momentum and customer investment in the development of HPC systems based on current and future Intel Xeon Phi processors and high-speed fabric technology,” said Charles Wuischpard, vice president, Data Center Group, and general manager of Workstations and HPC at Intel. “The integration of these fundamental HPC building blocks, combined with an open standards-based programming model, will maximize HPC system performance, broaden accessibility and use, and serve as the on-ramp to exascale.”
  • “The combination of Intel Xeon Phi coprocessors with our proprietary software allows us to provide our customers with one of the most powerful geo-processing production systems to date,” said Dr. Matt Lamont, managing director, DownUnder GeoSolutions. “Our Intel Xeon Phi powered solutions enable interactive processing and imaging from each of our geophysicists’ individual computers. A testing regime that once took weeks can now be achieved in days. We’re thrilled with the Intel Xeon Phi coprocessors and look forward to evaluating the next-generation product.”

Supporting Resources

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com, and about Intel’s conflict-free efforts at conflictfree.intel.com.

Intel, the Intel logo, Xeon and Intel Xeon Phi are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

1 Latency reductions based on Mellanox CS7500 Director Switch and Mellanox SB7700/SB7790 Edge switches compared to preliminary Intel simulations for Intel Omni-Path switches based on a 1024-node full bisectional bandwidth (FBB) Fat-Tree configuration (2-tier, 5 total switch hops), using a 48-port switch for Intel Omni-Path cluster and 36-port switch ASIC for either Mellanox or Intel® True Scale clusters.  Results have been estimated or simulated using internal Intel analysis or architecture simulation or modeling, and provided to you for informational purposes. Any differences in your system hardware, software or configuration may affect your actual performance.

2As compared to a shipping 36-port edge InfiniBand switch.

3 Reduction in up to ½ fewer switches claim based on a 1024-node full bisectional bandwidth (FBB) Fat-Tree configuration, using a 48-port switch for Intel Omni-Path cluster and 36-port switch ASIC for either Mellanox or Intel® True Scale clusters.

4 A2.3X based on 27,648 nodes based on a cluster configured with the Intel Omni-Path Architecture using 48-port switch ASICs, as compared with a 36-port switch chip that can support up to 11,664 nodes.

October 30 2014

Chip Shot: Microsoft and Intel Announce Collaboration at Open Compute EU Summit

Today at the Open Compute Project (OCP) European Summit, Microsoft announced the contribution of the 2nd generation Open CloudServer (OCSv2) specification to the OCP. Through a joint engineering collaboration with Intel, the companies have developed a…